Solvay adds 10% carbon fiber filled KetaSpire® polyetheretherketone (PEEK) and neat Radel® polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat®-Additive Manufacturing (AM) software. These products complement the neat KetaSpire® PEEK AM filament already available for simulation on e-Xstream engineering’s Digimat®-AM platform. “Our growing range of AM filaments underscores Solvay’s determination to establish itself … Continue reading Solvay expands offering of high-performance polymers for 3D-printing simulation