PEEK Compound for Monolayer E-Motor Magnet

Monolayer design eliminates adhesion and sustainability constraints of conventional PEEK or enamel insulation processes.

Monolayer e-motor magnet wire insulation

PEEK Compound for Monolayer E-Motor Magnet: Solvay has launched a new polyetheretherketone (PEEK) extrusion compound designed especially for copper magnet wire insulation in electric motors. The development of the KetaSpire KT-857 custom-engineered insulation material was driven by the move of OEMs toward higher density batteries and electric powertrains operating at 800 V or above to address consumers’ range anxiety.

“Higher voltage e-motors typically require thicker magnet insulation up to 180 microns,” explains Brian Baleno, head of marketing, automotive, at Solvay Materials. “In contrast to applying the insulation with a single PEEK extrusion layer, the polyimide process involves multiple application passes, which can potentially introduce defects that tend to magnify as the layers are added. On the other hand, one of the biggest challenges of standard PEEK extrusion is to obtain an adequate level of adhesion of the insulation to the copper magnet wire. Our KetaSpire KT-857 technology eliminates both of these constraints.”

In addition to ensuring better adhesion in a faster and more cost-efficient monolayer process, Solvay’s new magnet wire PEEK insulation grade also provides important sustainability benefits. The extrusion of a single insulation layer requires less energy, and in contrast to the enamel process there is no need for utilizing any volatile organic compounds. Simultaneously, KetaSpire KT-857 results in a more uniform insulation layer.

KetaSpire KT-857 complements the portfolio of Solvay’s dedicated high-performance e-motor solutions, which also include Ajedium PEEK film and Xydar LCP for slot liners; Amodel PPA and Ryton PPS resins for high-voltage connectors, connection rings, and busbars; and Xencor long-fiber thermoplastics for slot wedges.


PEEK Compound for Monolayer E-Motor Magnet: Original Article


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